Invention Grant
- Patent Title: Structure and method for advanced bulk fin isolation
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Application No.: US15069557Application Date: 2016-03-14
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Publication No.: US09583492B2Publication Date: 2017-02-28
- Inventor: Kangguo Cheng , Bruce B. Doris , Ali Khakifirooz , Darsen D. Lu , Alexander Reznicek , Kern Rim
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Daniel P. Morris, Esq.
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L21/8238 ; H01L21/02 ; H01L29/10 ; H01L21/308 ; H01L29/165

Abstract:
A non-planar semiconductor structure containing semiconductor fins that are isolated from an underlying bulk silicon substrate by an epitaxial semiconductor stack is provided. The epitaxial semiconductor material stack that provides the isolation includes, from bottom to top, a semiconductor punch through stop containing at least one dopant of a conductivity type which differs from the conductivity type of the particular device region that the semiconductor fin is formed in, and a semiconductor diffusion barrier layer containing no n- or p-type dopant.
Public/Granted literature
- US20160197077A1 STRUCTURE AND METHOD FOR ADVANCED BULK FIN ISOLATION Public/Granted day:2016-07-07
Information query
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