Invention Grant
- Patent Title: Memory device and method for manufacturing the same
- Patent Title (中): 存储器件及其制造方法
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Application No.: US14806832Application Date: 2015-07-23
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Publication No.: US09583536B2Publication Date: 2017-02-28
- Inventor: Erh-Kun Lai , Chao-I Wu , Yu-Hsuan Lin , Dai-Ying Lee
- Applicant: MACRONIX INTERNATIONAL CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L47/00
- IPC: H01L47/00 ; H01L27/24 ; H01L45/00

Abstract:
A memory device having an array area and a periphery area is provided. The memory device includes a substrate, an isolation layer formed in the substrate, a first doped region formed on the isolation layer in the array area, a second doped region formed on the first doped region, a metal silicide layer formed on the second doped region, and a metal silicide oxide layer formed on the metal silicide layer.
Public/Granted literature
- US20170025473A1 MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2017-01-26
Information query
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