Invention Grant
- Patent Title: Wafer level packaging for proximity sensor
- Patent Title (中): 接近传感器的晶圆级封装
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Application No.: US14668309Application Date: 2015-03-25
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Publication No.: US09583666B2Publication Date: 2017-02-28
- Inventor: Jing-En Luan
- Applicant: STMICROELECTRONICS PTE LTD
- Applicant Address: SG Singapore
- Assignee: STMICROELECTRONICS PTE LTD
- Current Assignee: STMICROELECTRONICS PTE LTD
- Current Assignee Address: SG Singapore
- Agency: Seed Intellectual Property Law Group LLP
- Priority: CN2014108332679 20141225
- Main IPC: H01L31/16
- IPC: H01L31/16 ; H01L25/16 ; H01L31/02 ; H01L31/0232 ; G01S17/02 ; G01S7/481
Abstract:
A proximity sensor includes a semiconductor die, a light emitting assembly, a redistribution layer, and an encapsulating layer. A surface of the semiconductor die includes a sensor area and contact pads. A lens is positioned over the sensor area of the semiconductor die. The light emitting assembly includes a light emitting device having a light emitting area, a lens positioned over the light emitting area, and contact pads that face the redistribution layer. A side of the redistribution layer includes contact pads. Electrical connectors place each of the contact pads of the semiconductor die in electrical communication with a respective one of the contact pads of the redistribution layer. The encapsulating layer is positioned on the redistribution layer and at least partially encapsulates the semiconductor die, the lens over the sensor area of the semiconductor die, and the light emitting assembly.
Public/Granted literature
- US20160190380A1 WAFER LEVEL PACKAGING FOR PROXIMITY SENSOR Public/Granted day:2016-06-30
Information query
IPC分类:
