Invention Grant
US09583688B2 Light emitting device mount, leadframe, and light emitting apparatus
有权
发光装置安装座,引线框架和发光装置
- Patent Title: Light emitting device mount, leadframe, and light emitting apparatus
- Patent Title (中): 发光装置安装座,引线框架和发光装置
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Application No.: US15015246Application Date: 2016-02-04
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Publication No.: US09583688B2Publication Date: 2017-02-28
- Inventor: Ryohei Yamashita , Ryoichi Yoshimoto
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Mori & Ward, LLP
- Priority: JP2013-052297 20130314
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/54 ; H01L33/48 ; H01L23/495 ; H01L23/00 ; H01L33/52

Abstract:
A light emitting device mount includes a positive lead terminal, a negative lead terminal, and a resin portion. Each of the positive and negative lead terminal includes a first main surface, a second main surface, and an end surface. The end surface is provided between the first main surface and the second main surface. The end surface includes a first recessed surface area and a second recessed surface area. The first recessed surface area is extending from a first point of the first main surface in cross section. The second recessed surface area is extending from a second point of the second main surface in cross section. The first and second recessed surface areas define a protruding portion protruding outwardly. The resin portion is positioned at least between the end surface of the positive lead terminal and the end surface of the negative lead terminal.
Public/Granted literature
- US20160155917A1 LIGHT EMITTING DEVICE MOUNT, LEADFRAME, AND LIGHT EMITTING APPARATUS Public/Granted day:2016-06-02
Information query
IPC分类: