Invention Grant
US09583811B2 Transition between a plastic waveguide and a semiconductor chip, where the semiconductor chip is embedded and encapsulated within a mold compound
有权
在塑料波导和半导体芯片之间的转变，其中半导体芯片被嵌入并封装在模具化合物内
- Patent Title: Transition between a plastic waveguide and a semiconductor chip, where the semiconductor chip is embedded and encapsulated within a mold compound
- Patent Title (中): 在塑料波导和半导体芯片之间的转变，其中半导体芯片被嵌入并封装在模具化合物内
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Application No.: US14453746Application Date: 2014-08-07
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Publication No.: US09583811B2Publication Date: 2017-02-28
- Inventor: Ernst Seler , Maciej Wojnowski , Walter Hartner , Josef Boeck
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01P5/107
- IPC: H01P5/107 ; H01P11/00 ; H01P1/04 ; H04B5/00
Abstract:
A microwave device includes a semiconductor package comprising a microwave semiconductor chip and a waveguide part associated with the semiconductor package. The waveguide part is configured to transfer a microwave waveguide signal. It includes one or more pieces. The microwave device further includes a transformer element configured to transform a microwave signal from the microwave semiconductor chip into the microwave waveguide signal or to transform the microwave waveguide signal into a microwave signal for the microwave semiconductor chip.
Public/Granted literature
- US20160043455A1 Microwave Chip Package Device Public/Granted day:2016-02-11
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