Invention Grant
US09585248B2 Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring board
有权
树脂组合物,树脂清漆,预浸料,金属包覆层压板和印刷线路板
- Patent Title: Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring board
- Patent Title (中): 树脂组合物,树脂清漆,预浸料,金属包覆层压板和印刷线路板
-
Application No.: US14988085Application Date: 2016-01-05
-
Publication No.: US09585248B2Publication Date: 2017-02-28
- Inventor: Hiroharu Inoue , Shingo Yoshioka
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2013-160215 20130801; JP2013-219022 20131022
- Main IPC: B32B15/08
- IPC: B32B15/08 ; B32B15/09 ; B32B15/092 ; B32B15/098 ; B32B27/04 ; C09J163/00 ; H05K1/03 ; C08L63/00 ; C08J5/24 ; C08L79/08 ; C09D163/00 ; C09D179/08 ; C08G59/24 ; C08G59/62

Abstract:
A resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x), when an amount of strain is increased from 0% to 0.3% by pulling at 999 μm/min while plotting the amount of strain on the x axis and tensile stress on the y axis, and also surrounded by the x axis, is greater than an area surrounded by a stress-strain curve f2(x), when the amount of strain is decreased from 0.3%, and also surrounded by the x axis, and the amount of change in the amount of strain when tensile stress is 0, before and after applying tensile stress, is 0.05% or less.
Public/Granted literature
- US20160143135A1 RESIN COMPOSITION, RESIN VARNISH, PREPREG, METAL-CLAD LAMINATED BOARD AND PRINTED WIRING BOARD Public/Granted day:2016-05-19
Information query