Invention Grant
- Patent Title: Method of forming a glass interposer with thermal vias
- Patent Title (中): 用热通孔形成玻璃插入件的方法
-
Application No.: US14668031Application Date: 2015-03-25
-
Publication No.: US09585257B2Publication Date: 2017-02-28
- Inventor: Jeffrey P. Gambino , Richard S. Graf , Sudeep Mandal , David J. Russell
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Scully Scott Murphy and Presser
- Agent Frank Digiglio
- Main IPC: H05K3/02
- IPC: H05K3/02 ; H05K3/00 ; H01L21/48 ; H01L21/768 ; H01L23/373 ; H05K1/02 ; H05K1/11 ; H05K3/40 ; H01L21/60
Abstract:
The present invention relates generally to integrated circuit (IC) chip packaging, and more particularly, to a structure and method of forming a glass interposer having thermally conductive vias in addition to electrically conductive vias. The thermally conductive vias help dissipate heat from one or more IC chips, through the glass interposer, into an organic carrying, and then, into an underlying substrate where it can be dissipated.
Public/Granted literature
- US20160286660A1 GLASS INTERPOSER WITH THERMAL VIAS Public/Granted day:2016-09-29
Information query
