Invention Grant
- Patent Title: Probe device having spring probe
- Patent Title (中): 探头装置有弹簧探针
-
Application No.: US14628658Application Date: 2015-02-23
-
Publication No.: US09588141B2Publication Date: 2017-03-07
- Inventor: Tsung-Yi Chen , Chien-Chou Wu , Tien-Chia Li , Ting-Hsin Kuo
- Applicant: MPI Corporation
- Applicant Address: TW Chu-Pei, Hsinchu Shien
- Assignee: MPI CORPORATION
- Current Assignee: MPI CORPORATION
- Current Assignee Address: TW Chu-Pei, Hsinchu Shien
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW103123651A 20140709
- Main IPC: G01R1/067
- IPC: G01R1/067 ; G01R1/073 ; G01R3/00

Abstract:
A probe device includes a spring probe having a spring sleeve with at least a spring section and a connection segment fixed to a needle and having a convex portion protruding over an outer cylinder surface of the spring section, and a probe seat having stacked dies and at least a guiding hole through which the probe is inserted. The dies includes a lower die, a supporting die above the lower die and a non-circular supporting hole at the supporting die. The distance between a supporting surface and a center of the supporting hole is greater than the radius of the outer cylinder surface and smaller than the distance between a guiding surface of the supporting hole and the center, which is greater than the maximum distance between the convex portion and a needle center, thereby preventing the probe receiving external force from exceeding deflection and bending.
Public/Granted literature
- US20150276807A1 PROBE DEVICE HAVING SPRING PROBE Public/Granted day:2015-10-01
Information query