This disclosure is directed to a composable thin computing device. An example device may comprise at least a device interface module, a communication module, a processing module, a memory module, a composable computing module and a power module. The device interface module may couple the device to an operational environment via at least one of a physical connector or a wireless connection. The communication module may at least one of transmit or receive data via the device interface module. The processing module may process the data. The memory module may store at least a portion of the data. The composable computing module may cause at least one of the above modules to perform certain functionality related to the operational environment. The power module may power at least one of the above modules.