Invention Grant
US09588931B2 Communication bridging between devices via multiple bridge elements
有权
通过多个桥接元件在设备之间进行通信桥接
- Patent Title: Communication bridging between devices via multiple bridge elements
- Patent Title (中): 通过多个桥接元件在设备之间进行通信桥接
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Application No.: US13753408Application Date: 2013-01-29
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Publication No.: US09588931B2Publication Date: 2017-03-07
- Inventor: Jason Wong , Lei Ming , Hyuck Jae Lee
- Applicant: Silicon Image, Inc.
- Applicant Address: US OR Portland
- Assignee: Lattice Semiconductor Corporation
- Current Assignee: Lattice Semiconductor Corporation
- Current Assignee Address: US OR Portland
- Agency: Fenwick & West LLP
- Main IPC: G06F13/42
- IPC: G06F13/42 ; H04L1/16 ; G06F13/40

Abstract:
Embodiments of the invention are generally directed to communication bridging between devices via multiple bridge elements. An embodiment of an apparatus includes a transmitter element to transmit data, and multiple bridge elements, the bridge elements including a first bridge element to receive data from the transmitter element and a second bridge element to provide data to a receiver. The bridge elements provide for one or more of translation of one or more commands for an operation from the transmitter element, wherein translation of commands includes handling of a command intended for the receiver, and pre-fetching of one or more data for the operation from the receiver.
Public/Granted literature
- US20130212309A1 COMMUNICATION BRIDGING BETWEEN DEVICES VIA MULTIPLE BRIDGE ELEMENTS Public/Granted day:2013-08-15
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