Invention Grant
US09589801B2 Methods for wafer bonding and for nucleating bonding nanophases using wet and steam pressurization
有权
使用湿和蒸汽加压的晶圆接合和成核结合纳米相的方法
- Patent Title: Methods for wafer bonding and for nucleating bonding nanophases using wet and steam pressurization
- Patent Title (中): 使用湿和蒸汽加压的晶圆接合和成核结合纳米相的方法
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Application No.: US14238979Application Date: 2012-10-31
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Publication No.: US09589801B2Publication Date: 2017-03-07
- Inventor: Nicole Herbots , Shawn Whaley , Robert Culbertson , Ross Bennett-Kennett , Ashlee Murphy , Matthew Bade , Sam Farmer , Brance Hudzietz
- Applicant: Nicole Herbots , Shawn Whaley , Robert Culbertson , Ross Bennett-Kennett , Ashlee Murphy , Matthew Bade , Sam Farmer , Brance Hudzietz
- Applicant Address: US AZ Scottsdale
- Assignee: Arizona Board Of Regents, A Body Corporated Of The State Of Arizona, Acting For And On Behalf Of Arizona State University
- Current Assignee: Arizona Board Of Regents, A Body Corporated Of The State Of Arizona, Acting For And On Behalf Of Arizona State University
- Current Assignee Address: US AZ Scottsdale
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- International Application: PCT/US2012/062746 WO 20121031
- International Announcement: WO2013/066977 WO 20130510
- Main IPC: H01L21/18
- IPC: H01L21/18
Abstract:
Substrates may be bonded according to a method comprising contacting a first bonding surface of a first substrate with a second bonding surface of a second substrate to form an assembly in the presence of an steam atmosphere under suitable conditions to form a bonding layer between the first and second surfaces, wherein the first bonding surface comprises a polarized surface layer; the second bonding surface comprises a hydrophilic surface layer; the first and second bonding surfaces are different.
Public/Granted literature
- US20140235031A1 Methods for Wafer Bonding and for Nucleating Bonding Nanophases Using Wet and Steam Pressurization Public/Granted day:2014-08-21
Information query
IPC分类:
