-
1.发明申请Methods for Wafer Bonding and for Nucleating Bonding Nanophases Using Wet and Steam Pressurization 有权使用湿法和蒸汽加压的晶圆粘结和成核结合纳米相的方法公开(公告)号：US20140235031A1
公开(公告)日：2014-08-21
申请号：US14238979
申请日：2012-10-31
Applicant: Nicole Herbots , Shawn Whaley , Robert Culbertson , Ross Bennett-Kennett , Ashlee Murphy , Matthew Bade , Sam Farmer , Brance Hudzietz
Inventor： Nicole Herbots , Shawn Whaley , Robert Culbertson , Ross Bennett-Kennett , Ashlee Murphy , Matthew Bade , Sam Farmer , Brance Hudzietz
IPC: H01L21/18
CPC classification number: H01L21/187
Abstract: Substrates may be bonded according to a method comprising contacting a first bonding surface of a first substrate with a second bonding surface of a second substrate to form an assembly in the presence of an steam atmosphere under suitable conditions to form a bonding layer between the first and second surfaces, wherein the first bonding surface comprises a polarized surface layer; the second bonding surface comprises a hydrophilic surface layer; the first and second bonding surfaces are different.
Abstract translation: 可以根据包括使第一基板的第一接合表面与第二基板的第二接合表面接触的方法来接合基板，以在合适的条件下在蒸汽气氛的存在下形成组件，以在第一和第 第二表面，其中所述第一接合表面包括极化表面层; 所述第二粘合表面包括亲水表面层; 第一和第二接合表面是不同的。
-
2.发明授权Methods for wafer bonding and for nucleating bonding nanophases using wet and steam pressurization 有权使用湿和蒸汽加压的晶圆接合和成核结合纳米相的方法公开(公告)号：US09589801B2
公开(公告)日：2017-03-07
申请号：US14238979
申请日：2012-10-31
Applicant: Nicole Herbots , Shawn Whaley , Robert Culbertson , Ross Bennett-Kennett , Ashlee Murphy , Matthew Bade , Sam Farmer , Brance Hudzietz
Inventor： Nicole Herbots , Shawn Whaley , Robert Culbertson , Ross Bennett-Kennett , Ashlee Murphy , Matthew Bade , Sam Farmer , Brance Hudzietz
IPC: H01L21/18
CPC classification number: H01L21/187
Abstract: Substrates may be bonded according to a method comprising contacting a first bonding surface of a first substrate with a second bonding surface of a second substrate to form an assembly in the presence of an steam atmosphere under suitable conditions to form a bonding layer between the first and second surfaces, wherein the first bonding surface comprises a polarized surface layer; the second bonding surface comprises a hydrophilic surface layer; the first and second bonding surfaces are different.
Abstract translation: 可以根据包括使第一基板的第一接合表面与第二基板的第二接合表面接触的方法来接合基板，以在合适的条件下在蒸汽气氛的存在下形成组件，以在第一和第 第二表面，其中所述第一接合表面包括极化表面层; 所述第二粘合表面包括亲水表面层; 第一和第二接合表面是不同的。
-
Search Results
2
records
(took 0.011 seconds)
