Invention Grant
- Patent Title: Semiconductor device packages and methods of manufacturing the same
- Patent Title (中): 半导体器件封装及其制造方法
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Application No.: US14332922Application Date: 2014-07-16
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Publication No.: US09589814B2Publication Date: 2017-03-07
- Inventor: Che-heung Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2013-0149995 20131204
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L21/48 ; H01L23/433 ; H01L23/495 ; H01L23/31 ; H01L23/00
Abstract:
A semiconductor device package may include: a semiconductor chip element; and a supporting structure on which the semiconductor chip element is mounted and including an electrical connection element for connecting the semiconductor chip element to an external terminal. The supporting structure may include: a first lead frame including a heat dissipation element; a second lead frame coupled to the first lead frame; and/or an insulator configured to electrically insulate the first and second lead frames from each other. Each of the first and second lead frames may include a mounting region on which the semiconductor chip element is mounted. The first lead frame may include: a first portion; and/or a second portion formed on the first portion and having a smaller width than that of the first portion. The insulator may be on the first portion around the second portion. The second lead frame may be on the insulator.
Public/Granted literature
- US20150155217A1 SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2015-06-04
Information query
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