Invention Grant
- Patent Title: Semiconductor package and method of fabricating the same
- Patent Title (中): 半导体封装及其制造方法
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Application No.: US14993054Application Date: 2016-01-11
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Publication No.: US09589842B2Publication Date: 2017-03-07
- Inventor: Inho Choi , Donghan Kim , Jae Choon Kim , Jikho Song , Mitsuo Umemoto
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR
- Agency: Renaissance IP Law Group LLP
- Priority: KR10-2015-0015356 20150130
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/485 ; H01L21/78 ; H01L21/56 ; H01L21/768 ; H01L23/00 ; H01L23/31
Abstract:
A method of fabricating a semiconductor package is disclosed. The method includes disposing semiconductor chips on a support substrate, forming a protection layer covering top surfaces of the semiconductor chips, forming a molding layer covering the support substrate and the protection layer, and etching the molding layer to expose the protection layer.
Public/Granted literature
- US20160225669A1 SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME Public/Granted day:2016-08-04
Information query
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