Invention Grant
- Patent Title: Power module and thermal interface structure thereof
- Patent Title (中): 电源模块及其热接口结构
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Application No.: US15094038Application Date: 2016-04-08
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Publication No.: US09589863B2Publication Date: 2017-03-07
- Inventor: Shouyu Hong , Yanlin Chen , Zhenqing Zhao
- Applicant: DELTA ELECTRONICS, INC.
- Applicant Address: TW Taoyuan
- Assignee: Delta Electronics, Inc.
- Current Assignee: Delta Electronics, Inc.
- Current Assignee Address: TW Taoyuan
- Agent Yunling Ren
- Priority: CN201510168819 20150410
- Main IPC: H01L23/36
- IPC: H01L23/36 ; H01L23/373
Abstract:
A power module and a thermal interface structure are provided herein. The thermal interface structure includes: a base and a plurality of filler particles distributed in the base. When the filler particles are under pressure, at least a part of the filler particles are deformed, and at least two adjacent filler particles partially contact with each other to form a heat-conducting path for transferring heat.
Public/Granted literature
- US20160300777A1 POWER MODULE AND THERMAL INTERFACE STRUCTURE THEREOF Public/Granted day:2016-10-13
Information query
IPC分类:
