公开(公告)号：US10886200B2

公开(公告)日：2021-01-05

申请号：US16258747

申请日：2019-01-28

Applicant: Delta Electronics,Inc.

Inventor： Shouyu Hong ,  Haibin Xu ,  Wei Cheng ,  Tao Wang ,  Zhenqing Zhao

IPC: H01L23/48 ,  H01L23/495 ,  H01L21/48 ,  H01L25/07 ,  H01L25/00 ,  H01L25/18

Abstract: The present disclosure relates to a power module and a manufacturing method thereof. The power module includes: a group of switch elements, a molding part and a connector. The group of switch elements includes at least one pair of switch elements. The molding part molds the group of switch elements. The connector includes a signal terminal and a power terminal respectively electrically connected to the signal end and power end of the group of switch elements, and both fanned out from the molding part. The power terminal includes a positive power terminal, a negative power terminal and an output power terminal. The positive power terminal and the negative power terminal are respectively a first metal layer and a second metal layer which are at least partially stacked, and an insulating layer is disposed between the first metal layer and the second metal layer.

公开(公告)号：US10297523B2

公开(公告)日：2019-05-21

申请号：US14959635

申请日：2015-12-04

Applicant: DELTA ELECTRONICS, INC.

Inventor： Shouyu Hong ,  Yanlin Chen ,  Zhenqing Zhao

IPC: H05K7/20 ,  H01L23/00 ,  H01L25/07 ,  H01L23/367 ,  H01L23/373 ,  H01L23/433 ,  H01L23/495

Abstract: A power module and a method for manufacturing the same are provided. The power module comprises: a substrate, at least one power device, and an organic heat dissipating structure. The substrate has an upper surface and a lower surface. The organic heat dissipating structure comprises a plurality of organic heat dissipating protrusions and it is located on the upper surface side or the lower surface side of the substrate and configured to transfer heat generated by the power device outwardly.

公开(公告)号：US10136545B2

公开(公告)日：2018-11-20

申请号：US15486591

申请日：2017-04-13

Applicant: DELTA ELECTRONICS, INC.

Inventor： Tao Wang ,  Kai Lu ,  Zhenqing Zhao ,  Shouyu Hong ,  Wei Cheng

IPC: H05K7/14 ,  H05K1/18 ,  H05K5/03 ,  H01L23/04 ,  H01L25/07

Abstract: The present invention provides a power module including a substrate and a modular housing structure. The substrate includes an electronic element disposed thereon. The modular housing structure is disposed on the substrate and located around the electronic element. The modular housing structure includes a plurality of sidewalls configured to connect with each other detachably. Each sidewall includes two connecting elements disposed on two opposite ends thereof respectively. The two connecting elements of any one of the sidewalls are connected to two corresponding connecting elements of two adjacent sidewalls respectively. Consequently, the numbers and connections of the sidewalls are adjustable and varied according to the size of the substrate so as to avoid the waste of space and enhance the power density.

公开(公告)号：US11533819B2

公开(公告)日：2022-12-20

申请号：US16404854

申请日：2019-05-07

Applicant: Delta Electronics, Inc.

Inventor： Le Liang ,  Zhenqing Zhao

IPC: H05K7/14 ,  H01L25/07

Abstract: A method for manufacturing a stack structure comprises: providing a lead frame having a metal frame, at least two metal plate portions and a plurality of connection ribs, the connection ribs each comprises a first end, a second end and a connection portion; directly mounting electronic components for constructing two modules on the metal plate portions; packaging the electronic components of the first module, the first ends of the metal connection components which are electrically connected to the first module and the first ends of the part of the connection ribs which are electrically connected to the first module are packaged therein; removing the metal frame and part or whole of the connection ribs, the remaining connection ribs forms pins; and bending the metal connection component so that the two modules connected by the metal connection components are stacked one upon the other, to form the stack structure.

公开(公告)号：US10784612B2

公开(公告)日：2020-09-22

申请号：US16234861

申请日：2018-12-28

Applicant: Delta Electronics, Inc.

Inventor： Shouyu Hong ,  Qingdong Chen ,  Ganyu Zhou ,  Pengkai Ji ,  Yiqing Ye ,  Zhenqing Zhao

IPC: H01R13/22 ,  H01R12/71 ,  H01R43/16 ,  H01R13/405

Abstract: The present disclosure provides a connector which is a combination of at least one power pin, one plastic member, and one signal pin, wherein the power pin includes a columnar metal block, each plastic member is connected to the columnar metal block at side surface, each signal pin is attached to a side surface of the plastic member, and extends to two bottom surfaces of the plastic member to form contact surfaces with predetermined areas on the two bottom surfaces; wherein, the contact surface on first bottom surface of the plastic member is flush with first bottom surface of the metal block, and the contact surface on second bottom surface of the plastic member is flush with second bottom surface of the metal block.

公开(公告)号：US09887183B2

公开(公告)日：2018-02-06

申请号：US15151730

申请日：2016-05-11

Applicant: DELTA ELECTRONICS, INC.

Inventor： Tao Wang ,  Zhenqing Zhao ,  Zeng Li ,  Kai Lu

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/053 ,  H01L23/31 ,  H01L23/498 ,  H01L25/07 ,  H01L23/24

CPC classification number: H01L25/162 ,  H01L23/053 ,  H01L23/24 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5385 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0603 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/32225 ,  H01L2224/37147 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/85801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/05032 ,  H01L2924/05042 ,  H01L2924/0532 ,  H01L2924/05432 ,  H01L2924/12035 ,  H01L2924/1205 ,  H01L2924/1207 ,  H01L2924/13023 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1426 ,  H01L2924/15724 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/15763 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: The present disclosure provides a power module with the integration of a control circuit at least, including: a power substrate; a power device mounted on the power substrate; and at least one control substrate which supports the control circuit, is electrically connected with the power substrate and disposed at an angle of inclination on a surface of the power substrate on which the power device is mounted; wherein the angle of inclination is greater than or equal to 45 degrees and smaller than or equal to 135 degrees. In the power module provided by the present disclosure, only the power substrate as well as the connections between the control substrate and the power substrate occupies the footprint area of the power module, and thus the horizontal footprint area of the power module is effectively reduced and thereby the power density of the power module is increased.

公开(公告)号：US10342153B2

公开(公告)日：2019-07-02

申请号：US15291155

申请日：2016-10-12

Applicant: DELTA ELECTRONICS, INC.

Inventor： Le Liang ,  Zhenqing Zhao

IPC: H05K7/00 ,  H05K7/14 ,  H01L25/07

Abstract: Disclosed is a stack structure and its manufacturing method. The stack structure includes at least two stacked modules, wherein at least one of the modules is a power module; at least one metal connection component which is in integrated structure and comprises a first end, a second end and a connection portion with the first end being electrically connected to one of the modules and the second end being electrically connected to the other module; at least one molding compound packaging the at least one module and the end of the metal connection component which is electrically connected to the module, respectively.

公开(公告)号：US10249550B2

公开(公告)日：2019-04-02

申请号：US15720062

申请日：2017-09-29

Applicant: Delta Electronics, Inc.

Inventor： Pengkai Ji ,  Shouyu Hong ,  Zhenqing Zhao ,  Jianhong Zeng

IPC: H05K1/18 ,  H01L23/31 ,  H01L23/492 ,  H01L21/56 ,  H05K1/02 ,  H05K1/11 ,  H05K3/30 ,  H05K3/40

Abstract: The present invention provides a power module and a manufacturing method thereof. The power module includes a carrier board and a lead component stacked relative to the carrier board. The lead component includes an initial plane, plural first pins and plural second pin. The initial plane includes a vertical projection overlapping with the carrier board. The first pins are electrically connected to the carrier board and vertical to the initial plane. The second pins are electrically connected to the carrier board and vertical to the initial plane. An isolation gap is disposed in the initial plane and located between the first pins and the second pins. The initial plane is separated into a first plane and a second plane by the isolation gap, so as to electrically isolate the first pins and the second pins from each other.

公开(公告)号：US10104813B2

公开(公告)日：2018-10-16

申请号：US15165273

申请日：2016-05-26

Applicant: DELTA ELECTRONICS, INC.

Inventor： Wei Cheng ,  Shouyu Hong ,  Zhenqing Zhao ,  Tao Wang

IPC: H05K7/20 ,  H01L23/373 ,  H01L23/40 ,  H01L23/498 ,  H05K1/02 ,  H01L23/053 ,  H01L23/473 ,  H01L23/24

Abstract: A power circuit module is provided. The encapsulated power circuit module comprises: a pressure plate comprising a protrusion body; a frame; and a substrate bearing a power circuit, the power circuit comprising at least a power switching device; the frame is provided between the substrate and the pressure plate, the frame supports the pressure plate, and a substantially closed space is formed by the substrate, the pressure plate and the frame; and when an external force is applied on the pressure plate, the protrusion body press against the substrate and is in insulation contact with the substrate, and the external force is transmitted evenly on the substrate.

公开(公告)号：US20170339798A1

公开(公告)日：2017-11-23

申请号：US15486591

申请日：2017-04-13

Applicant: DELTA ELECTRONICS, INC.

Inventor： Tao Wang ,  Kai Lu ,  Zhenqing Zhao ,  Shouyu Hong ,  Wei Cheng

IPC: H05K7/14 ,  H05K5/03 ,  H05K1/18

CPC classification number: H05K7/1432 ,  H01L23/04 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K1/181 ,  H05K5/03 ,  H05K7/1401 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: The present invention provides a power module including a substrate and a modular housing structure. The substrate includes an electronic element disposed thereon. The modular housing structure is disposed on the substrate and located around the electronic element. The modular housing structure includes a plurality of sidewalls configured to connect with each other detachably. Each sidewall includes two connecting elements disposed on two opposite ends thereof respectively. The two connecting elements of any one of the sidewalls are connected to two corresponding connecting elements of two adjacent sidewalls respectively. Consequently, the numbers and connections of the sidewalls are adjustable and varied according to the size of the substrate so as to avoid the waste of space and enhance the power density.