Invention Grant
- Patent Title: Substrate with embedded sintered heat spreader and process for making the same
- Patent Title (中): 带嵌入式烧结散热器的基板及其制造方法
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Application No.: US14937550Application Date: 2015-11-10
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Publication No.: US09589864B2Publication Date: 2017-03-07
- Inventor: Tarak A. Railkar
- Applicant: RF Micro Devices, Inc.
- Applicant Address: US NC Greensboro
- Assignee: Qorvo US, Inc.
- Current Assignee: Qorvo US, Inc.
- Current Assignee Address: US NC Greensboro
- Agency: Withrow & Terranova, P.L.L.C.
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L23/00 ; H01L21/48
Abstract:
The present disclosure relates to a substrate with an embedded sintered heat spreader and a process for making the same. According to an exemplary process, at least one cavity is created through the substrate. Sinterable paste including metal particulates and binder material is then dispensed into the at least one cavity. Next, the sinterable paste is sintered to create a sintered heat spreader, which is characterized by high thermal conductivity. The sintered heat spreader adheres to the inside walls of the at least one cavity, enhancing the overall thermal conductivity of the substrate.
Public/Granted literature
- US20160336254A1 SUBSTRATE WITH EMBEDDED SINTERED HEAT SPREADER AND PROCESS FOR MAKING THE SAME Public/Granted day:2016-11-17
Information query
IPC分类:
