公开(公告)号：US09589864B2

公开(公告)日：2017-03-07

申请号：US14937550

申请日：2015-11-10

Applicant: RF Micro Devices, Inc.

Inventor： Tarak A. Railkar

IPC: H01L23/373 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L23/3736 ,  H01L21/4871 ,  H01L21/4882 ,  H01L23/3677 ,  H01L24/83 ,  H01L2224/8385

Abstract: The present disclosure relates to a substrate with an embedded sintered heat spreader and a process for making the same. According to an exemplary process, at least one cavity is created through the substrate. Sinterable paste including metal particulates and binder material is then dispensed into the at least one cavity. Next, the sinterable paste is sintered to create a sintered heat spreader, which is characterized by high thermal conductivity. The sintered heat spreader adheres to the inside walls of the at least one cavity, enhancing the overall thermal conductivity of the substrate.

Abstract translation: 本发明涉及具有嵌入式烧结散热器的基板及其制造方法。 根据示例性工艺，通过衬底产生至少一个空腔。 然后将包括金属微粒和粘合剂材料的可烧结糊剂分配到至少一个空腔中。 接下来，将可烧结糊料烧结以产生热导率高的烧结散热器。 烧结散热器附着在至少一个空腔的内壁上，增强了基板的整体导热性。

公开(公告)号：US20160336254A1

公开(公告)日：2016-11-17

申请号：US14937550

申请日：2015-11-10

Applicant: RF Micro Devices, Inc.

Inventor： Tarak A. Railkar

IPC: H01L23/373 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/3736 ,  H01L21/4871 ,  H01L21/4882 ,  H01L23/3677 ,  H01L24/83 ,  H01L2224/8385

Abstract: The present disclosure relates to a substrate with an embedded sintered heat spreader and a process for making the same. According to an exemplary process, at least one cavity is created through the substrate. Sinterable paste including metal particulates and binder material is then dispensed into the at least one cavity. Next, the sinterable paste is sintered to create a sintered heat spreader, which is characterized by high thermal conductivity. The sintered heat spreader adheres to the inside walls of the at least one cavity, enhancing the overall thermal conductivity of the substrate.

Abstract translation: 本发明涉及具有嵌入式烧结散热器的基板及其制造方法。 根据示例性工艺，通过衬底产生至少一个空腔。 然后将包括金属微粒和粘合剂材料的可烧结糊剂分配到至少一个空腔中。 接下来，将可烧结糊料烧结以产生热导率高的烧结散热器。 烧结散热器附着在至少一个空腔的内壁上，增强了基板的整体导热性。