Invention Grant
US09589917B1 Microwave monolithic integrated circuit (MMIC) having integrated high power thermal dissipating load
有权
具有集成大功率散热负载的微波单片集成电路（MMIC）
- Patent Title: Microwave monolithic integrated circuit (MMIC) having integrated high power thermal dissipating load
- Patent Title (中): 具有集成大功率散热负载的微波单片集成电路（MMIC）
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Application No.: US15075874Application Date: 2016-03-21
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Publication No.: US09589917B1Publication Date: 2017-03-07
- Inventor: Istvan Rodriguez , Christopher M. Laighton , Alan J. Bielunis
- Applicant: Raytheon Company
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Agency: Daly, Crowley, Mofford & Durkee, LLP
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01L23/64 ; H01L23/48 ; H01L27/085 ; H01L29/20
Abstract:
A Microwave Monolithic Integrated Circuit (MMIC) having an integrated high power load. The MMIC includes a microwave transmission line and a resistive load coupled to a terminating end of the microwave transmission line. The resistive load comprises a hollow resistive material disposed on sidewalls of a via passing through a substrate, the resistive material having an upper portion electrically connected to a terminating end of a strip conductor of the microwave transmission line strip conductor and a lower portion electrically connected to the ground plane.
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