Invention Grant
- Patent Title: Method for separating regions of a semiconductor layer
- Patent Title (中): 分离半导体层的区域的方法
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Application No.: US14430872Application Date: 2013-09-26
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Publication No.: US09589943B2Publication Date: 2017-03-07
- Inventor: Lorenzo Zini , Bernd Boehm
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
- Current Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
- Current Assignee Address: DE Regensburg
- Agency: McDermott Will & Emery LLP
- Priority: DE102012217524 20120927; DE102012220909 20121115
- International Application: PCT/EP2013/070042 WO 20130926
- International Announcement: WO2014/049038 WO 20140403
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L31/101 ; H01L25/16 ; H01L33/00 ; H01L33/20

Abstract:
The invention relates to a method for separating regions of a semiconductor layer and for introducing an outcoupling structure into an upper side of the semiconductor layer, the outcoupling structure being provided to couple light out of the semiconductor layer. The upper side of the semiconductor layer is covered by a mask having first openings for introducing the outcoupling structure and at least a second opening, which is provided to introduce a separating trench into the semiconductor layer. With the aid of an etching method, the outcoupling structure is introduced into the upper side of the semiconductor layer in the region of the first openings and simultaneously a separating trench passing through the semiconductor layer is introduced into the semiconductor layer via the second opening, and a region of the semiconductor layer is separated.
Public/Granted literature
- US20150287880A1 METHOD FOR SEPARATING REGIONS OF A SEMICONDUCTOR LAYER Public/Granted day:2015-10-08
Information query
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