Invention Grant
- Patent Title: System on chip
- Patent Title (中): 片上系统
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Application No.: US14872774Application Date: 2015-10-01
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Publication No.: US09589955B2Publication Date: 2017-03-07
- Inventor: Sang-Hoon Baek , Sun-Young Park , Sang-Kyu Oh , Ha-Young Kim , Jung-Ho Do , Moo-Gyu Bae , Seung-Young Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2015-0056266 20150422
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L29/40 ; H01L27/088 ; H01L27/02 ; H01L27/11

Abstract:
Systems on chips are provided. A system on chip (SoC) includes a first gate line, a second gate line and a third gate line extending in a first direction, a gate isolation region cutting the first gate line, the second gate line and the third gate line and extending in a second direction across the first direction, a first gate contact formed on the second gate line arranged between the first gate line and the third gate line, and electrically connecting the cut second gate line, a second gate contact formed on the first gate line, a third gate contact formed on the third gate line, a first metal line electrically connecting the second gate contact and the third gate contact, and a second metal line electrically connected to the first gate contact.
Public/Granted literature
- US20160099211A1 SYSTEM ON CHIP Public/Granted day:2016-04-07
Information query
IPC分类: