Invention Grant
- Patent Title: Thin film solder bond
- Patent Title (中): 薄膜焊点
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Application No.: US13460786Application Date: 2012-04-30
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Publication No.: US09590130B2Publication Date: 2017-03-07
- Inventor: Anthony Lochtefeld , Chris Leitz , Mark Carroll
- Applicant: Anthony Lochtefeld , Chris Leitz , Mark Carroll
- Applicant Address: US NH Salem
- Assignee: AMBERWAVE INC.
- Current Assignee: AMBERWAVE INC.
- Current Assignee Address: US NH Salem
- Main IPC: H01L31/044
- IPC: H01L31/044 ; H01L31/18 ; H01L31/0687
Abstract:
A device, system, and method for solar cell construction and bonding/layer transfer are disclosed herein. An exemplary structure of solar cell construction involves providing a monocrystalline donor layer. A solder bonding layer bonds the donor layer to a carrier substrate. A porous layer may be used to separate the donor layer.
Public/Granted literature
- US20120273043A1 Thin Film Solder Bond Public/Granted day:2012-11-01
Information query
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