Invention Grant
- Patent Title: Aperture-coupled microstrip antenna and manufacturing method thereof
- Patent Title (中): 孔径耦合微带天线及其制造方法
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Application No.: US13826515Application Date: 2013-03-14
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Publication No.: US09590309B2Publication Date: 2017-03-07
- Inventor: Young Jun Hong , Kun Kook Park , Kun Soo Shin , Tae Wan Koo , Ji Kwon Kim , Jong Gwan Yook
- Applicant: Samsung Electronics Co., Ltd. , Industry-Academic Cooperation Foundation, Yonsei University
- Applicant Address: KR Suwon-si KR Seoul
- Assignee: Samsung Electronics Co., Ltd.,Industry-Academic Cooperation Foundation, Yonsei University
- Current Assignee: Samsung Electronics Co., Ltd.,Industry-Academic Cooperation Foundation, Yonsei University
- Current Assignee Address: KR Suwon-si KR Seoul
- Agency: NSIP Law
- Priority: KR10-2012-0054722 20120523
- Main IPC: H01Q9/04
- IPC: H01Q9/04 ; H01P11/00 ; H01P5/107
Abstract:
An aperture-coupled microstrip antenna and a manufacturing method thereof are provided. The aperture-coupled microstrip antenna includes a radiating patch including an aperture, and a ground plane disposed below the radiating patch. The aperture-coupled microstrip antenna further includes a shorting wall connecting the radiating patch with the ground plane, and a microstrip feeder configured to apply electromagnetic waves to the aperture.
Public/Granted literature
- US20130314283A1 APERTURE-COUPLED MICROSTRIP ANTENNA AND MANUFACTURING METHOD THEREOF Public/Granted day:2013-11-28
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