Invention Grant
- Patent Title: Housing features of an electronic device
- Patent Title (中): 电子设备的外壳特性
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Application No.: US14618744Application Date: 2015-02-10
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Publication No.: US09591110B2Publication Date: 2017-03-07
- Inventor: Matthew D. Hill , Derek C. Krass , Benjamin Shane Bustle , Lucy Elizabeth Browning , Michael Benjamin Wittenberg , James B. Smith , Ashutosh Y. Shukla , Scott A. Myers
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Brownstein Hyatt Farber Schreck, LLP
- Main IPC: H04M1/02
- IPC: H04M1/02

Abstract:
An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.
Public/Granted literature
- US20160072932A1 HOUSING FEATURES OF AN ELECTRONIC DEVICE Public/Granted day:2016-03-10
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