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1.发明申请公开(公告)号：US20210081000A1
公开(公告)日：2021-03-18
申请号：US17018130
申请日：2020-09-11
申请人： Apple Inc.
摘要： The disclosed technology relates to a dual board-to-board connector battery management circuit module utilizing a switch-back service loop for a battery pack. The management circuit module is coupled to a first and second terminal of a battery pack and includes a first board-to-board connector disposed proximal to a first end of the management circuit module; and a second board-to-board connector disposed proximal to a second end of the management circuit module. The second board-to-board connector is positioned opposite the first board-to-board connector.
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公开(公告)号：US20170290207A1
公开(公告)日：2017-10-05
申请号：US15250066
申请日：2016-08-29
申请人： Apple Inc.
发明人： James B. Smith , Daniel W. Jarvis , David A. Pakula , Gregory N. Stephens , Nicholas G. L. Merz , Shayan Malek , Sina Bigdeli
IPC分类号： H05K9/00 , H01L23/552 , H05K1/18
CPC分类号： H05K9/003 , H01L23/552 , H01L2224/16225 , H01L2224/73253 , H01L2924/16152 , H05K1/18 , H05K9/0024 , H05K9/0088
摘要： Electrical components may be shielded using a shielding can or other shielding structure that covers the electrical components. The electrical components and the shielding structure may be mounted on a substrate such as a printed circuit board using solder or other conductive material. The shielding structure may have one or more shielding layers. The shielding layers may include high conductivity material for providing shielding for radio-frequency electromagnetic interference and magnetic material for blocking magnetic flux. Shielding structures may be formed from materials such as ferritic stainless steel, coatings that enhance solderability, corrosion resistance, and conductivity, magnetic materials printed or otherwise formed on metal layers, and other shielding structures.
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公开(公告)号：US20160057897A1
公开(公告)日：2016-02-25
申请号：US14805780
申请日：2015-07-22
申请人： Apple Inc.
IPC分类号： H05K9/00
CPC分类号： H05K9/0024
摘要： An electronic device may have electrical components mounted on substrates such as printed circuits. The electrical components may include magnetic components such as inductors. A metal shielding can may be provided with a magnetic shielding layer to shield the magnetic components. The magnetic shielding layer may be formed on an inner surface of the metal shielding can. The magnetic shielding layer may include a ferromagnetic layer that is attached to the inner surface by a layer of adhesive. An insulating coating may be formed on the lower surface of the ferromagnetic layer to prevent shorts. An insulating layer for the lower surface of the ferromagnetic layer may be formed form a layer of polymer that is attached to the ferromagnetic layer with adhesive. The shielding can with magnetic shielding may withstand solder reflow temperatures, allowing the shielding can to be soldered to a printed circuit to shield an electrical component.
摘要翻译： 电子设备可以具有安装在诸如印刷电路的基板上的电气部件。 电气部件可以包括诸如电感器的磁性部件。 金属屏蔽壳可以设置有磁屏蔽层以屏蔽磁性部件。 磁屏蔽层可以形成在金属屏蔽罐的内表面上。 磁屏蔽层可以包括通过一层粘合剂附着到内表面的铁磁层。 可以在铁磁层的下表面上形成绝缘涂层以防止短路。 用于铁磁层的下表面的绝缘层可以形成为用粘合剂附接到铁磁层的聚合物层。 具有磁屏蔽的屏蔽罐可以承受焊料回流温度，允许屏蔽罐焊接到印刷电路以屏蔽电气部件。
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公开(公告)号：US11792309B2
公开(公告)日：2023-10-17
申请号：US17378695
申请日：2021-07-17
申请人： Apple Inc.
发明人： Matthew D. Hill , Derek C. Krass , Benjamin Shane Bustle , Lucy Elizabeth Browning , Michael Benjamin Wittenberg , James B. Smith , Ashutosh Y. Shukla , Scott A. Myers
CPC分类号： H04M1/0249 , H04M1/02 , H04M1/0202 , H04M1/0247 , H04M1/23
摘要： An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.
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5.发明授权公开(公告)号：US10696078B2
公开(公告)日：2020-06-30
申请号：US16127071
申请日：2018-09-10
申请人： Apple Inc.
发明人： Jason Sloey , Simon C. Helmore , James B. Smith
IPC分类号： H05K7/00 , B41M5/24 , G06F1/16 , H04M1/02 , H01P3/08 , H05K1/02 , H05K1/18 , H05K5/00 , H05K5/02 , H05K5/03 , H05K5/06 , H05K9/00 , F28F21/08 , H05K7/20 , H01R12/79 , H05K1/14 , H02J50/10 , H02J7/02
摘要： This application relates to a flexible cable for a portable electronic device, where the portable electronic device includes operational components having connectors that are capable of being electrically coupled to the flexible cable. The flexible cable includes a dielectric substrate having a generally planar shape, an upper grounding plane, a lower grounding plane, and a first signal transmission line that is separated by the upper and lower grounding planes, where the dielectric substrate is capable of electromagnetically shielding the first signal transmission line.
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公开(公告)号：US20190141171A1
公开(公告)日：2019-05-09
申请号：US16241914
申请日：2019-01-07
申请人： Apple Inc.
发明人： Matthew D. Hill , Derek C. Krass , Benjamin Shane Bustle , Lucy Elizabeth Browning , Michael Benjamin Wittenberg , James B. Smith , Ashutosh Y. Shukla , Scott A. Myers
IPC分类号： H04M1/02
摘要： An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.
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公开(公告)号：US09591110B2
公开(公告)日：2017-03-07
申请号：US14618744
申请日：2015-02-10
申请人： Apple Inc.
发明人： Matthew D. Hill , Derek C. Krass , Benjamin Shane Bustle , Lucy Elizabeth Browning , Michael Benjamin Wittenberg , James B. Smith , Ashutosh Y. Shukla , Scott A. Myers
IPC分类号： H04M1/02
CPC分类号： H04M1/0249
摘要： An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.
摘要翻译： 公开了一种用于形成外壳的外壳和方法。 外壳可以由诸如铝的金属形成，并且还包括允许透射和接收电磁波的非金属部分。 非金属部分可以互锁到外壳，特别是与外壳内的区域相连，包括与非金属部分相比具有相对高的强度和刚度的第一材料。 联锁装置可以包括形成燕尾切口进入外壳以接纳非金属部分，钻入包围内部的孔或空腔，其包括内螺纹，以及插入第一材料中的杆以向非金属部分提供张力。 还公开了使用阳极氧化组装内部部件的方法。
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公开(公告)号：US20210344784A1
公开(公告)日：2021-11-04
申请号：US17378695
申请日：2021-07-17
申请人： Apple Inc.
发明人： Matthew D. Hill , Derek C. Krass , Benjamin Shane Bustle , Lucy Elizabeth Browning , Michael Benjamin Wittenberg , James B. Smith , Ashutosh Y. Shukla , Scott A. Myers
IPC分类号： H04M1/02
摘要： An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.
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公开(公告)号：US10547717B2
公开(公告)日：2020-01-28
申请号：US16241914
申请日：2019-01-07
申请人： Apple Inc.
发明人： Matthew D. Hill , Derek C. Krass , Benjamin Shane Bustle , Lucy Elizabeth Browning , Michael Benjamin Wittenberg , James B. Smith , Ashutosh Y. Shukla , Scott A. Myers
摘要： An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.
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10.发明授权公开(公告)号：US12055973B2
公开(公告)日：2024-08-06
申请号：US17018130
申请日：2020-09-11
申请人： Apple Inc.
IPC分类号： G06F1/16 , H01M10/42 , H01M50/247 , H01M50/296 , H01M50/531 , H05K1/14
CPC分类号： G06F1/1632 , G06F1/1635 , H01M10/425 , H01M50/247 , H01M50/296 , H01M50/531 , H05K1/14 , H01M2010/4271 , H01M2220/30 , H05K2201/055 , H05K2201/10037
摘要： The disclosed technology relates to a dual board-to-board connector battery management circuit module utilizing a switch-back service loop for a battery pack. The management circuit module is coupled to a first and second terminal of a battery pack and includes a first board-to-board connector disposed proximal to a first end of the management circuit module; and a second board-to-board connector disposed proximal to a second end of the management circuit module. The second board-to-board connector is positioned opposite the first board-to-board connector.
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