Invention Grant
- Patent Title: Heat treatment method
- Patent Title (中): 热处理方法
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Application No.: US13636530Application Date: 2011-03-24
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Publication No.: US09593390B2Publication Date: 2017-03-14
- Inventor: Kazuhiko Katsumata
- Applicant: Kazuhiko Katsumata
- Applicant Address: JP
- Assignee: IHI CORPORATION
- Current Assignee: IHI CORPORATION
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JPP2010-070242 20100325
- International Application: PCT/JP2011/057249 WO 20110324
- International Announcement: WO2011/118737 WO 20110929
- Main IPC: C21D6/00
- IPC: C21D6/00 ; C21D1/667 ; C21D1/76 ; C21D9/00 ; F27B9/20 ; F27B9/24 ; F27B9/26 ; F27D7/06 ; F27D9/00 ; F27D15/02 ; C21D1/20 ; C21D1/22

Abstract:
The heat treatment method of the present invention includes: a first step of mist cooling a treatment object retained at a prescribed temperature by supplying mist-like coolant, to a target temperature near to and higher than a first transformation point at which a structure of the treatment object begins to be transformed into a prescribed structure; a second step, following the first step, of retaining the treatment object for a prescribed time in a state where supply of mist-like coolant is stopped; and a third step, following the second step, of cooling the treatment object to a temperature lower than or equal to the first transformation point. According to the present invention, it is possible to provide a heat treatment method capable of suppressing irregularity and deformation in the structure of the treatment object.
Public/Granted literature
- US20130008567A1 HEAT TREATMENT METHOD Public/Granted day:2013-01-10
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