Invention Grant
- Patent Title: LED package and a backlight unit comprising said LED package
- Patent Title (中): LED封装和包括所述LED封装的背光单元
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Application No.: US14668295Application Date: 2015-03-25
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Publication No.: US09594207B2Publication Date: 2017-03-14
- Inventor: Geun-Young Kim , Tomohisa Onishi , Jung-Hun Lee , Young-Taek Kim , Jong-Jin Park , Mi-Jeong Yun , Young-Sam Park , Hun-Joo Hahm , Hyung-Suk Kim , Seong-Yeon Han , Do-Hun Kim , Dae-Yeon Kim , Dae-Hyun Kim , Jung-Kyu Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2008-0064367 20080703; KR10-2008-0072564 20080725; KR10-2008-0093102 20080923; KR10-2008-0104721 20081024; KR10-2008-0104722 20081024; KR10-2009-0002788 20090113; KR10-2009-0006340 20090123; KR10-2009-0060886 20090703
- Main IPC: F21V7/04
- IPC: F21V7/04 ; G09F13/08 ; G09F13/04 ; H01L23/48 ; H01L23/02 ; F21V8/00 ; G02F1/1335 ; H01L33/48 ; H01L33/62 ; H01L33/58
Abstract:
A light emitting diode (LED) package includes: a main body mounted on a substrate; a light emitting diode that is mounted in the main body and emits light; and a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted. A backlight unit includes: a light guide plate configured to allow a light source to proceed to a liquid crystal panel; a light emitting diode (LED) mounted in a main body mounted on a substrate and generating a light source; and an LED package having a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted, and being mounted on the light guide plate.
Public/Granted literature
- US20150198762A1 LED PACKAGE AND A BACKLIGHT UNIT COMPRISING SAID LED PACKAGE Public/Granted day:2015-07-16
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