公开(公告)号：US09594207B2

公开(公告)日：2017-03-14

申请号：US14668295

申请日：2015-03-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Geun-Young Kim ,  Tomohisa Onishi ,  Jung-Hun Lee ,  Young-Taek Kim ,  Jong-Jin Park ,  Mi-Jeong Yun ,  Young-Sam Park ,  Hun-Joo Hahm ,  Hyung-Suk Kim ,  Seong-Yeon Han ,  Do-Hun Kim ,  Dae-Yeon Kim ,  Dae-Hyun Kim ,  Jung-Kyu Park

IPC: F21V7/04 ,  G09F13/08 ,  G09F13/04 ,  H01L23/48 ,  H01L23/02 ,  F21V8/00 ,  G02F1/1335 ,  H01L33/48 ,  H01L33/62 ,  H01L33/58

CPC classification number: G02B6/0073 ,  G02B6/0023 ,  G02B6/005 ,  G02F1/133606 ,  G02F2001/133601 ,  G02F2001/133607 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00011

Abstract: A light emitting diode (LED) package includes: a main body mounted on a substrate; a light emitting diode that is mounted in the main body and emits light; and a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted. A backlight unit includes: a light guide plate configured to allow a light source to proceed to a liquid crystal panel; a light emitting diode (LED) mounted in a main body mounted on a substrate and generating a light source; and an LED package having a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted, and being mounted on the light guide plate.

Abstract translation: 发光二极管（LED）封装包括：安装在基板上的主体; 发光二极管，其安装在主体内并发光; 并且引线框架暴露以允许主体选择性地顶部安装或侧面安装。 背光单元包括：导光板，被配置为允许光源前进到液晶面板; 安装在安装在基板上并产生光源的主体中的发光二极管（LED）; 以及LED封装，其具有暴露的引线框架，以允许主体选择性地顶部安装或侧面安装，并且安装在导光板上。