Invention Grant
- Patent Title: Methods of processing substrates
- Patent Title (中): 处理基板的方法
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Application No.: US14150906Application Date: 2014-01-09
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Publication No.: US09595446B2Publication Date: 2017-03-14
- Inventor: Chungsun Lee , Jung-Hwan Kim , Kwang-chul Choi , Un-Byoung Kang , Jeon Il Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2013-0008695 20130125
- Main IPC: H01L21/46
- IPC: H01L21/46 ; H01L21/302 ; H01L21/683 ; H01L21/02 ; H01L23/00
Abstract:
Methods processing substrates are provided. The method may include providing a bonding layer between a substrate and a carrier to bond the substrate to the carrier, processing the substrate while the substrate is supported by the carrier, and removing the bonding layer to separate the substrate from the carrier. The bonding layer may include a thermosetting glue layer and thermosetting release layers provided on opposing sides of the thermosetting glue layer.
Public/Granted literature
- US20140213039A1 METHODS OF PROCESSING SUBSTRATES Public/Granted day:2014-07-31
Information query
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