Invention Grant
- Patent Title: Semiconductor device with different contact regions
- Patent Title (中): 具有不同接触区域的半导体器件
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Application No.: US14821969Application Date: 2015-08-10
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Publication No.: US09595619B2Publication Date: 2017-03-14
- Inventor: Holger Hüsken , Anton Mauder , Hans-Joachim Schulze , Wolfgang Rösner , Holger Schulze
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/872
- IPC: H01L29/872 ; H01L29/417 ; H01L29/66 ; H01L29/47 ; H01L29/32 ; H01L29/45 ; H01L29/868 ; H01L29/36 ; H01L29/16 ; H01L29/20

Abstract:
A semiconductor device includes at least one first contact region of a vertical device between a semiconductor substrate and an electrically conductive structure arranged adjacent to the semiconductor substrate, and at least one second contact region of the vertical device between the semiconductor substrate of the semiconductor device and the electrically conductive structure. The at least one first contact region is arranged adjacent to the at least one second contact region. The electrically conductive structure includes a first electrically conductive material in contact with the semiconductor substrate in an area of the at least one first contact region and a second electrically conductive material in contact with the semiconductor substrate in an area of the at least one second contact region, so that a first contact characteristic within the at least one first contact region differs from a second contact characteristic within the at least one second contact region.
Public/Granted literature
- US20160043237A1 Semiconductor Device with Different Contact Regions Public/Granted day:2016-02-11
Information query
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