Invention Grant
US09596749B2 Circuit board having a signal layer with signal traces and a reference plane with an additional signal trace larger than the signal traces
有权
电路板具有带信号迹线的信号层和具有大于信号迹线的附加信号迹线的参考平面
- Patent Title: Circuit board having a signal layer with signal traces and a reference plane with an additional signal trace larger than the signal traces
- Patent Title (中): 电路板具有带信号迹线的信号层和具有大于信号迹线的附加信号迹线的参考平面
-
Application No.: US14567916Application Date: 2014-12-11
-
Publication No.: US09596749B2Publication Date: 2017-03-14
- Inventor: Kuan-Yu Chen , Yun Ling , Mohd Muhaiyiddin Bin Abdullah , Jackson Chung Peng Kong , Chung-Hao Chen , Hao-Han Hsu , Xiang Li
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: International IP Law Group, P.L.L.C.
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01P3/18 ; H01P3/02 ; H05K3/46 ; H01P11/00
Abstract:
Techniques for routing signal traces in a circuit board are described. An example of an electronic device in accordance with the described techniques includes a circuit board comprising a plurality of conductive layers. The conductive layers include a signal layer and a reference plane. The signal layer includes signal traces and the reference plane includes an additional signal trace.
Public/Granted literature
- US20160174361A1 SIGNAL ROUTING Public/Granted day:2016-06-16
Information query
