Invention Grant
- Patent Title: 3D thermal detection circuits and methods
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Application No.: US14055909Application Date: 2013-10-17
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Publication No.: US09599517B2Publication Date: 2017-03-21
- Inventor: Szu-Lin Liu , Jaw-Juinn Horng , Yung-Chow Peng
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: G01K7/00
- IPC: G01K7/00 ; G01K7/21 ; G01K7/20

Abstract:
A circuit includes sensing circuitry including at least one sensing element configured to output at least one temperature-dependent voltage. A compare circuit is configured to generate at least one intermediate voltage in response to comparing the at least one temperature-dependent voltage to a feedback voltage. A control circuit is configured to generate at least one control signal in response to the intermediate voltage. A switching circuit is configured to couple a capacitor coupled to a feedback node to one of a first voltage supply and a second voltage supply in response to the at least one control signal to generate an output signal having a pulse width that is based on a temperature sensed by the sensing circuitry.
Public/Granted literature
- US20150110158A1 3D THERMAL DETECTION CIRCUITS AND METHODS Public/Granted day:2015-04-23
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