Invention Grant
- Patent Title: Probing method, probe card for performing the method, and probing apparatus including the probe card
-
Application No.: US14085945Application Date: 2013-11-21
-
Publication No.: US09599663B2Publication Date: 2017-03-21
- Inventor: Sang-Boo Kang , Ki-Sub Lim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: Lee & Morse P.C.
- Priority: KR10-2013-0024747 20130308
- Main IPC: G01R21/00
- IPC: G01R21/00 ; G01R31/28
Abstract:
A probe method includes setting an allowable temperature range, the allowable temperature range including a test temperature and ensuring contact between a pad of a circuit substrate and a needle of a probe card, providing the probe card with a temperature within the allowable temperature range, contacting the needle of the probe card to the pad of the circuit substrate, and supplying a test current to the pad through the needle to test the circuit substrate.
Public/Granted literature
- US20140253154A1 PROBING METHOD, PROBE CARD FOR PERFORMING THE METHOD, AND PROBING APPARATUS INCLUDING THE PROBE CARD Public/Granted day:2014-09-11
Information query
