Invention Grant
- Patent Title: Making Z-fold micro-wire substrate structure
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Application No.: US14289896Application Date: 2014-05-29
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Publication No.: US09603240B2Publication Date: 2017-03-21
- Inventor: Ronald Steven Cok , Thomas Nathaniel Tombs
- Applicant: Eastman Kodak Company
- Applicant Address: US NY Rochester
- Assignee: EASTMAN KODAK COMPANY
- Current Assignee: EASTMAN KODAK COMPANY
- Current Assignee Address: US NY Rochester
- Agent Raymond L. Owens; Williams R. Zimmerli; Kevin E. Spaulding
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/02 ; H05K3/22 ; H05K3/10 ; H05K3/12 ; H05K3/46 ; G06F3/044

Abstract:
A method of making a folded micro-wire substrate structure includes providing a flexible substrate and first, second, and third portions. One or more electrical conductors are formed on or in the flexible substrate. The flexible substrate is folded with a first fold between the first and second portions so that the first portion is located adjacent to the second portion in a perpendicular direction. The flexible substrate is folded with at least a second fold between the second and third portions so that the second side is between the second portion and the third portion in the perpendicular direction. The folded flexible substrate is secured to form the folded micro-wire substrate structure.
Public/Granted literature
- US20150351220A1 MAKING Z-FOLD MICRO-WIRE SUBSTRATE STRUCTURE Public/Granted day:2015-12-03
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