Invention Grant
- Patent Title: System including a module
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Application No.: US14822281Application Date: 2015-08-10
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Publication No.: US09606313B2Publication Date: 2017-03-28
- Inventor: Arlen L. Roesner , Paul Kessler Rosenberg , Michael Renne Ty Tan
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Houston
- Agency: Hewlett Packard Enterprise Patent Department
- Main IPC: G02B6/36
- IPC: G02B6/36 ; G02B6/43 ; G02B6/44 ; H05K5/00 ; H05K7/02 ; G02B6/38 ; G02B6/42

Abstract:
A system includes a chassis and a slot in the chassis. The slot has a depth dimension along which a removable module may be moved to insert the module in the slot and remove the module from the slot. The system includes waveguides, which have couplers that are arranged at different depths of the slot to couple the waveguides to the module in response to the module being inserted into the slot.
Public/Granted literature
- US20150346444A1 SYSTEM INCLUDING A MODULE Public/Granted day:2015-12-03
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