Invention Grant
- Patent Title: Bond pad sharing for powering a multiplicity of electrical components of a recording head
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Application No.: US14812041Application Date: 2015-07-29
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Publication No.: US09607640B2Publication Date: 2017-03-28
- Inventor: Declan Macken , Jason Bryce Gadbois , Timothy William Stoebe , Narayanan Ramakrishnan
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Cupertino
- Assignee: SEAGATE TECHNOLOGY LLC
- Current Assignee: SEAGATE TECHNOLOGY LLC
- Current Assignee Address: US CA Cupertino
- Agency: Hollingsworth Davis, LLC
- Main IPC: G11B21/20
- IPC: G11B21/20 ; G11B5/60 ; G11B7/125 ; G11B5/012 ; G11B5/00 ; G11B5/31 ; G11B5/48
Abstract:
An apparatus includes a slider of a recording head comprising a plurality of electrical bond pads coupled to bias sources and a ground pad. Each of a plurality of electrical components of the slider is coupled to at least one of the electrical bond pads. At least one of the electrical bond pads is a shared electrical bond pad coupled to at least two of the electrical components. At least one diode is coupled to at least one of the electrical bond pads and at least one of the electrical components.
Public/Granted literature
- US20170032810A1 BOND PAD SHARING FOR POWERING A MULTIPLICITY OF ELECTRICAL COMPONENTS OF A RECORDING HEAD Public/Granted day:2017-02-02
Information query
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