Invention Grant
- Patent Title: Probe pad design to reduce saw defects
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Application No.: US14563085Application Date: 2014-12-08
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Publication No.: US09607926B2Publication Date: 2017-03-28
- Inventor: Manoj Jain
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Jacqueline J. Garner; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L23/48
Abstract:
An integrated circuit wafer and fabrication method includes a probe pad structure in saw lanes between integrated circuits. The probe pad structure includes a probe pad with a plurality of pad segments. The pad segments are elements of an interconnect level of the wafer.
Public/Granted literature
- US20150170983A1 PROBE PAD DESIGN TO REDUCE SAW DEFECTS Public/Granted day:2015-06-18
Information query
IPC分类:
