- 专利标题： Processes for fabricating MEMS switches and other miniaturized devices having encapsulating enclosures
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申请号： US14696623申请日： 2015-04-27
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公开(公告)号： US09613770B2公开(公告)日： 2017-04-04
- 发明人: John E. Rogers , Michael R. Weatherspoon
- 申请人： HARRIS CORPORATION
- 申请人地址： US FL Melbourne
- 专利权人： Harris Corporation
- 当前专利权人： Harris Corporation
- 当前专利权人地址： US FL Melbourne
- 代理机构： Fox Rothschild LLP
- 代理商 Robert J. Sacco; Carol E Thorstad-Forsyth
- 主分类号： B05D5/12
- IPC分类号： B05D5/12 ; H01H49/00 ; H01H1/00 ; H01H59/00 ; B05D1/32 ; B81C1/00 ; B05D7/00
摘要：
Miniaturized devices such as MEMS switches (10) have encapsulating enclosures (100). The enclosure (100) and the remainder of the switch (10) are fabricated on a concurrent basis by depositing layers of an electrically-conductive material, such as copper, on a substrate (26).
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