A waterproof seal for electrical assemblies having conductive wires attached to a metal contact and inserted into a connector body. The conductive wires and metal contact are coated with solder to fill the gaps. The space between the soldered wires and the connector body are filled with an epoxy. The wire insulation and connector body are continuously sealed with a bonding agent. A section of wire insulation and the connector body are encased within an outer plastic jacket overmold.