Invention Grant
- Patent Title: Substrate conveyance mechanism and component mounting device
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Application No.: US14773052Application Date: 2014-03-03
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Publication No.: US09615494B2Publication Date: 2017-04-04
- Inventor: Toshihiko Nagaya , Hiroyuki Fujiwara , Shigeo Ogata , Yoshinori Konda , Yoichi Makino , Shinji Yamamoto , Shuuichi Kubota , Kimio Ilzuka , Koji Sakurai
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JP2013-044971 20130307
- International Application: PCT/JP2014/001146 WO 20140303
- International Announcement: WO2014/136426 WO 20140912
- Main IPC: B65G21/22
- IPC: B65G21/22 ; B65G47/22 ; H05K13/02 ; H05K13/00 ; H05K13/04

Abstract:
A substrate conveyance mechanism includes conveyance units and a clamp mechanism. The conveyance units include a working unit corresponding to a working area for types of substrates having different sizes of length taken as objects, an area length of the working area being variable in accordance with the sizes of length, and a stand-by unit corresponding to a stand-by area for the substrate to be carried-in to the working area. The clamp members include commonly used first clamp members and second clamp members which are attachable and detachable and are selectively used in accordance with the sizes of length of the plurality of types of substrates in addition to the first clamp members.
Public/Granted literature
- US20160021800A1 SUBSTRATE CONVEYANCE MECHANISM AND COMPONENT MOUNTING DEVICE Public/Granted day:2016-01-21
Information query
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