Metal gate transistor, integrated circuits, systems, and fabrication methods thereof

发明授权

US09620421B2 Metal gate transistor, integrated circuits, systems, and fabrication methods thereof 有权

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专利标题： Metal gate transistor, integrated circuits, systems, and fabrication methods thereof
申请号： US12948184

申请日： 2010-11-17
公开(公告)号： US09620421B2

公开(公告)日： 2017-04-11
发明人: Chien-Chih Ho , Chih-Ping Chao , Hua-Chou Tseng , Chun-Hung Chen , Chia-Yi Su , Alex Kalnitsky , Jye-Yen Cheng , Harry-Hak-Lay Chuang
申请人： Chien-Chih Ho , Chih-Ping Chao , Hua-Chou Tseng , Chun-Hung Chen , Chia-Yi Su , Alex Kalnitsky , Jye-Yen Cheng , Harry-Hak-Lay Chuang
申请人地址： TW
专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
当前专利权人地址： TW
代理机构： Hauptman Ham, LLP
主分类号： H01L21/8238
IPC分类号： H01L21/8238 ; H01L21/768 ; H01L21/8234 ; H01L29/51 ; H01L29/66

Metal gate transistor, integrated circuits, systems, and fabrication methods thereof

摘要：

A method of forming an integrated circuit structure includes providing a gate strip in an inter-layer dielectric (ILD) layer. The gate strip comprises a metal gate electrode over a high-k gate dielectric. An electrical transmission structure is formed over the gate strip and a conductive strip is formed over the electrical transmission structure. The conductive strip has a width greater than a width of the gate strip. A contact plug is formed above the conductive strip and surrounded by an additional ILD layer.

公开/授权文献

US20120119306A1 METAL GATE TRANSISTOR, INTEGRATED CIRCUITS, SYSTEMS, AND FABRICATION METHODS THEREOF 公开/授权日：2012-05-17

信息查询

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822	.....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8232	......场效应工艺
H01L21/8234	.......MIS工艺
H01L21/8238	........互补场效应晶体管，例如CMOS