A bonding head and a die bonding apparatus having the same are disclosed. The bonding head includes a body connected to a driving section for transferring the die, a plate heater mounted to a lower surface of the body and a collet mounted to a lower surface of the plate heater and configured to hold the die using a vacuum pressure. A cooling channel is formed at the lower surface of the body, and cooling passages are formed through the body and connected with the cooling channel to supply a cooling fluid into the cooling channel and to recover the cooling fluid from the cooling channel thereby cooling the plate heater.