发明授权
- 专利标题: Integrated chip carriers with thermocycler interfaces and methods of using the same
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申请号: US12761917申请日: 2010-04-16
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公开(公告)号: US09623413B2公开(公告)日: 2017-04-18
- 发明人: Geoffrey Facer , Robert Grossman , Marc Unger , Phillip Lam , Hou-Pu Chou , Jake Kimball , Martin Pieprzyk , Antoine Daridon
- 申请人: Geoffrey Facer , Robert Grossman , Marc Unger , Phillip Lam , Hou-Pu Chou , Jake Kimball , Martin Pieprzyk , Antoine Daridon
- 申请人地址: US CA South San Francisco
- 专利权人: Fluidigm Corporation
- 当前专利权人: Fluidigm Corporation
- 当前专利权人地址: US CA South San Francisco
- 代理机构: Kilpatrick Townsend & Stockton LLP
- 主分类号: B01L3/00
- IPC分类号: B01L3/00 ; B01L7/00 ; B01L9/00 ; C30B7/00 ; C30B29/58 ; C30B35/00 ; B01L3/02 ; B01L3/06
摘要:
Methods and systems are provided for conducting a reaction at a selected temperature or range of temperatures over time. An array device is provided. The array device contains separate reaction chambers and is formed as an elastomeric block from multiple layers. At least one layer has at least one recess that recess has at least one deflectable membrane integral to the layer with the recess. The array device has a thermal transfer device proximal to at least one of the reaction chambers. The thermal transfer device is formed to contact a thermal control source. Reagents for carrying out a desired reaction are introduced into the array device. The array device is contacted with a thermal control device such that the thermal control device is in thermal communication with the thermal control source so that a temperature of the reaction in at least one of the reaction chamber is changed as a result of a change in temperature of the thermal control source.
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