A thermal management article, a method for forming a thermal management article and a thermal management method are disclosed. Forming a thermal management article includes forming a duct adapted to be inserted into a groove on the surface of a substrate, and attaching the duct to the groove so that the top outer surface of the duct is substantially flush with the surface of the substrate. Thermal management of a substrate includes transporting a fluid through the duct of a thermal management article to alter the temperature of the substrate.