Invention Grant
- Patent Title: Ejection assembly with plug feature
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Application No.: US14805035Application Date: 2015-07-21
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Publication No.: US09627797B2Publication Date: 2017-04-18
- Inventor: Yuanyuan Song , Wei Guang Wu , SungChang Lee
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Brownstein Hyatt Farber Schreck, LLP
- Main IPC: H01R13/62
- IPC: H01R13/62 ; H01R13/52

Abstract:
Disclosed herein is a plug feature for an electronic device. More specifically, the plug feature described herein is used to plug, fill or otherwise seal an aperture associated with a SIM tray of an electronic device. The plug feature may be coupled to an ejection mechanism and may extend at least partially into an aperture defined by the SIM tray and/or an aperture defined by the housing of the electronic device.
Public/Granted literature
- US20170025785A1 EJECTION ASSEMBLY WITH PLUG FEATURE Public/Granted day:2017-01-26
Information query