EJECTION ASSEMBLY WITH PLUG FEATURE
    4.
    发明申请
    EJECTION ASSEMBLY WITH PLUG FEATURE 有权
    喷射装配与插头功能

    公开(公告)号:US20170025785A1

    公开(公告)日:2017-01-26

    申请号:US14805035

    申请日:2015-07-21

    Applicant: Apple Inc.

    CPC classification number: H01R13/5213 H01R13/443 H01R13/631 H01R13/6397

    Abstract: Disclosed herein is a plug feature for an electronic device. More specifically, the plug feature described herein is used to plug, fill or otherwise seal an aperture associated with a SIM tray of an electronic device. The plug feature may be coupled to an ejection mechanism and may extend at least partially into an aperture defined by the SIM tray and/or an aperture defined by the housing of the electronic device.

    Abstract translation: 这里公开了一种用于电子设备的插头功能。 更具体地,本文所述的插头特征用于插入,填充或以其他方式密封与电子设备的SIM托盘相关联的孔。 插头特征可以联接到弹出机构,并且可以至少部分地延伸到由SIM托盘限定的孔和/或由电子设备的壳体限定的孔中。

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