- Patent Title: Multi-band filter module and electronic device comprising the same
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Application No.: US14327151Application Date: 2014-07-09
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Publication No.: US09628048B2Publication Date: 2017-04-18
- Inventor: Kuang-woo Nam , In-sang Song , Chul-soo Kim , Yun-kwon Park , Eun-seok Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2006-0071079 20060727
- Main IPC: H03H9/70
- IPC: H03H9/70 ; H03H9/72 ; H03H9/46 ; H03H9/10 ; H03H9/54 ; H03H9/64 ; H03H3/02 ; H03H3/08 ; H03H3/007

Abstract:
A method of fabricating a multi-band filter module is provided. The method includes forming a Film Bulk Acoustic Resonator (FBAR) on a piezoelectric substrate by forming a resonant part on the piezoelectric substrate and then an air gap recessed on a surface of the piezoelectric substrate and positioned under the resonant part; and forming a Surface Acoustic Wave (SAW) device on the piezoelectric substrate in which the steps of forming the FBAR and the SAW are concurrently performed.
Public/Granted literature
- US20140312993A1 METHOD OF FABRICATING MULTI-BAND FILER MODULE Public/Granted day:2014-10-23
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