- 专利标题： Semiconductor light emitting device and method for manufacturing the same
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申请号： US14562998申请日： 2014-12-08
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公开(公告)号： US09634212B2公开(公告)日： 2017-04-25
- 发明人: Masahiko Kobayakawa , Kazuhiro Mireba , Shintaro Yasuda , Junichi Itai , Taisuke Okada
- 申请人： ROHM CO., LTD.
- 申请人地址： JP Kyoto
- 专利权人： ROHM CO., LTD.
- 当前专利权人： ROHM CO., LTD.
- 当前专利权人地址： JP Kyoto
- 代理机构： Hamre, Schumann, Mueller & Larson, P.C.
- 优先权： JP2008-060781 20080311; JP2008-236997 20080916; JP2009-003288 20090109
- 主分类号： H01L33/62
- IPC分类号： H01L33/62 ; H01L23/495 ; H01L23/31 ; H01L33/48 ; H01L33/54 ; H01L25/075 ; H01L25/16
摘要：
A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
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