Invention Grant
- Patent Title: Heat dissipating device and electronic apparatus
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Application No.: US14463275Application Date: 2014-08-19
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Publication No.: US09635781B2Publication Date: 2017-04-25
- Inventor: Chao-Wen Lu , Chun-Chih Wang , Ding-Wei Chiu
- Applicant: DELTA ELECTRONICS, INC.
- Applicant Address: TW Taoyuan Hsien
- Assignee: DELTA ELECTRONICS, INC.
- Current Assignee: DELTA ELECTRONICS, INC.
- Current Assignee Address: TW Taoyuan Hsien
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW102147877A 20131224
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K7/20
Abstract:
A heat dissipating device for dissipating the heat produced by a heating element is disclosed. The heat dissipating device includes a fixing assembly, two moving assemblies and an elastic assembly. The fixing assembly has a thermal conductive member. Each moving assembly has a mass body and is relatively moveable with respect to the fixing assembly. The two moving assemblies are disposed on two opposite sides of the fixing assembly, respectively, and each moving assembly forms a moving space with respect to the fixing assembly. The elastic assembly connects the fixing assembly to the two moving assemblies.
Public/Granted literature
- US20150177795A1 HEAT DISSIPATING DEVICE AND ELECTRONIC APPARATUS Public/Granted day:2015-06-25
Information query
