- 专利标题: Multi-layered structure
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申请号: US14991307申请日: 2016-01-08
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公开(公告)号: US09636026B2公开(公告)日: 2017-05-02
- 发明人: Jami A. Hafiz , Stefan Schibli , Jens Troetzschel
- 申请人: HERAEUS DEUTSCHLAND GMBH & CO. KG
- 申请人地址: DE Hanau
- 专利权人: Heraeus Deutschland GmbH & Co. KG
- 当前专利权人: Heraeus Deutschland GmbH & Co. KG
- 当前专利权人地址: DE Hanau
- 代理机构: Dicke, Billig & Czaja, PLLC
- 主分类号: H01L51/00
- IPC分类号: H01L51/00 ; A61B5/00 ; A61B5/04 ; A61N1/05 ; H01B7/04 ; H01B1/12 ; H01B3/30 ; B21F19/00 ; A61B5/042 ; A61M25/09
摘要:
One aspect relates to a layered structure with a substrate, a first layer over the substrate, and a second layer over the first layer. The substrate and the second layer are an electrically conductive material and the first layer is an insulating material or the substrate and the second layer are insulating material and the first layer is electrically conductive material. At least one of the first and second layers comprises an electrically conductive polymer.
公开/授权文献
- US20160120423A1 MULTI-LAYERED STRUCTURE 公开/授权日:2016-05-05